Bumps (BOP) on the bond pad structure

Embodiments of the invention described herein provides an increased surface area of ​​the overlap between the bonding structure of the package and the bonded substrate. By the use of the package and / or engagement structures on the elongated structure and orientation by the engagement structure engaging structure designed to withstand the stress caused by thermal cycling engaged to reduce cold welding. The present invention also discloses the one kind of bump pads (BOP) engagement structure.