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Machining Characteristic Analysis of Single Crystal Silicon Wafer Using Enveloping of Acceleration Signal
Machining Characteristic Analysis of Single Crystal Silicon Wafer Using Enveloping of Acceleration Signal
2009
D. Y. Lee
K.H. Song
S.H. Nam
W.P. Hong
S. W. Lee
Keywords:
Machining
single crystal silicon wafer
Optoelectronics
Materials science
Acceleration
Correction
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