Evaluation of Encapsulation Resin Structure for POL Tile

Demand for power modules is increasing year by year. In order to meet the demands of various power systems and cost reduction, it is required to develop a simple and small package that can share development resources. Power Overlay (POL) tile is small power module that has the potential to realize these demands. In this report, encapsulant and structure used for POL tile were studied, that is under fill process and molding process. It was found that the reliability was significantly improved by changing from underfill resin to mold resin.