Packaging RF Devices and Modules

RF packaging technologies are advancing rapidly. This article provides basic knowledge to understand the technology advances. Most packaging issues common to those for microelectronics packaging will not be covered here, and they can be found in other articles. The following sections will focus on unique issues for RF packaging. Representative packages and assembly technologies will be reviewed. Critical consideration of RF performance and reliability will be introduced. The reliability section will cover both thermal management and mechanical integrity. A case study will be presented to illustrate a typical design procedure considering various factors. In addition, computer-aided-design (CAD) issues and advanced packaging concepts will be introduced, to understand future challenges. Keywords: compuer-aided design; radiofrequency packaging; thermal management; mechanical integrity; integrated circuit