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Defect Identification Method of CMC Bonding Structure based on Dynamic Time Warping and Simulation Analysis
Defect Identification Method of CMC Bonding Structure based on Dynamic Time Warping and Simulation Analysis
2021
Zhang X.-J.
Ren J
Zhang D
Gu J
Li Z.-L.
Zhou T
Keywords:
structure based
Algorithm
Computer science
Dynamic time warping
Correction
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