Stress relieving unit and its manufacturing method, and an electronic device mounting structure

The present invention relates to stress relieving unit and its manufacturing method, and an electronic device mounting structure. Mounting structure for mounting an electronic component on a circuit board comprising: a stress releasing means, which comprises a cross-section smaller than the cross section of the end portion of the central unit stress relieving portion; a first coupling part, which is arranged to release the stress means coupled to an end portion of the electrode pads of the electronic component; a second coupling part, which is provided to the other end portion of the stress relieving means is coupled to the connection pads of the circuit board. Between a plurality of binding is provided with a hollow space, each of said binding structure comprising the first binding portion, said stress releasing means and said second coupling portion.