Power Module on Copper Lead Frame with Novel Sintering Paste and SnSb solder

Die attach and interconnect materials for power module device studied in this experiment included pressure-less sintering paste and SnSb solder. The initial evaluation on various pressure-less silver (Ag) sintering die attach pastes showed that type A paste doesn't form the void after cure, type B with void seen and type C paste has vertical vein likes void seen after oven cure. During copper clip attachment, undesired interconnect seen which caused short circuit between gate and source pads. The proper control during clip attachment was carried out, a good interconnect joint formation without short circuit between gate and source pads was achieved for both pressure-less Ag sintering paste and SnSb solder. Flux cleaning process assisted in removing flux residual on the SnSb reflowed samples.