Method for electroplating surface of molybdenum and copper alloy

The invention discloses a method for electroplating the surface of a molybdenum and copper alloy. The method comprises the following steps of: 1, removing oil; 2, scouring; 3, activating; 4, planting nickel; 5, carrying out vacuum heat treatment; 6, removing oil; 7, activating; and 8, carrying out subsequent electroplating. An oxide film on the surface of the molybdenum and copper alloy can be completely removed through steps of scouring and activating, a thin nickel layer is electroplated on the surface of the molybdenum and copper alloy through steps of plating nickel and carrying out vacuum heat treatment, and then the vacuum heat treatment is carried out, so that a diffusion layer with better bonding force is formed by a nickel plating layer and a base material and then is activated, and a required plating layer can be electroplated continuously. According to the method, the problem of poor bonding force of the electroplating layer of the molybdenum and copper alloy is solved, theoxide film before the molybdenum and copper alloy is electroplated is removed, process parameters of nickel pre-plating and vacuum heat treatment are determined, and an activating method of electroplating on a nickel-plated base layer is determined.