Copper stripping process for dummy plates/corrugated plates for PCB electroplating

The invention relates to a copper stripping process for dummy plates/corrugated plates for PCB electroplating. The copper stripping process comprises the steps of selecting alloy material with the corrosion resistance and the electricity conductivity and making the alloy material into the dummy plates or the corrugated plates; placing the dummy plates or the corrugated plates of the same size into an electrolytic bath with electrolytes formed by mixing sulfuric acid and copper sulfate in a stacking mode; conducting direct currents and stopping electricity conduction when copper is dissolved, wherein the current density is controlled to be within 1-5 ASD and the conduction time is controlled to be within 2-12 hours; carrying out cleaning, taking out the dissolved dummy plates or the dissolved corrugated plates from a clean water container after cleaning is completed, and stripping copper on the dummy plates or the corrugated plates through a stripping device. According to the process, plating layers can be conveniently stripped through the electrolysis stripping process, batched work can be realized through the process steps, the stripping mode is simple, damage of stripping to the dummy plates and/or the corrugated plates is avoided, the dummy plates and/or the corrugated plates can be repeatedly and effectively used for a long time, the service life can be longer than 5 years, and the cost can be effectively lowered.