On-wafer passives de-embedding based on open-pad and Transmission Line measurement

In this paper, a new de-embedding technique based on open-pad and Transmission Line (TL) measurement is discussed. This technique can be used as an alternative to the conventional de-embedding approaches in order to characterize on-chip passives in the millimeter wave range of frequencies. Using open-pad measurement, parallel parasitics are extracted and removed in the first step. Cross-talk parasitics between two pads that are kept at a constant distance can be assumed constant, and thus both cross-talk and parallel parasitics can be removed. Subsequently, the transfer function matrix of a single-ended TL is used to de-embed series parasitics from the measurement results. The measurement results are in a close agreement with the simulations up to 110 GHz.