Transfer assembly with dry adhesion structure and method for transferring led structure assembly using the same and led structure assembly

The invention as a separate LED structure, or LED structure, even repeated transfer step of the array and the adhesive force of the LED structure can be maintained, the removal of the mother substrate used for the growth of the LED structure and the other substrate during the manufacturing process of the LED structure array transcripts of the LED array structure having a dry bonding structure in which movement is easy, and an object thereof is to provide a conveyance method of the LED array structure using the same. The present invention to accomplish this is the form of van der Waals force or capillary force added ciliary arranged in any pattern over the LED structure and the contact subject to transfer to, the body as a transfer member of the LED structure array having a dry adhesive structure It characterized in that for holding the adhesion of the LED structure. Thus, the present invention is of the mother substrate used for the growth in a dry adhesive before through the transfer member during the manufacturing process of the LED structure can be maintained and the adhesion of the individual LED structures, or LED structure, even repeated transfer step of the array LED structure, LED structure removal is easy, and there is an advantage that the LED structure can be easily moved to a different substrate.