Photographing module, molded circuit board assembly and molded photosensitive assembly thereof and manufacturing methods

A photographing module (100, 100'), a molded circuit board assembly (10) and a molded photosensitive assembly (10') thereof and manufacturing methods. The molded circuit board assembly (10) comprises a circuit board (11) and a molded base (12). The molded base (12) is integrated with the circuit board by means of a molding process. The molded photosensitive assembly (10') comprises a circuit board (11'), a photosensitive element (13'), and a molded base (12'). The molded base (12') is integrated with the circuit board and the photosensitive element by means of the molding process. The molded base (12, 12') forms a light window (122, 122'). The position of the light window (122, 122') corresponds to that of the photosensitive element (13, 13'), and the cross section of the light window (122, 122') is constructed into a trapezoid or multi-step trapezoid that increases gradually from bottom to top, so as to facilitate demolding, prevent damage to the molded base and avoid stray light.