Release film frame

A release film frame weitbar, when a semiconductor wafer (W) mounted on a release film (T, Ta) is attached, in the chip (CP) is divided, so that the chip (CP) are separated, wherein the separating film frame: a plurality of frame members (21 to 24, 31 to 34, 52, 53, 62, 63, 72, 73, 82, 83) carrying the separating film (T, Ta); and a connecting device (25 to 28, 45 to 47, 66, 67, 77, 86) connecting the plurality of frame members (21 to 24, 31 to 34, 52, 53, 62, 63, 72, 73, 82, 83) combines such that the plurality of frame members (21 to 24, 31 to 34, 52, 53, 62, 63, 72, 73, 82, 83) assumes a ring shape, wherein the connecting device (25 to 28, 45 to 47, 56), the plurality of frame members (21 to 24, 31 to 34, 52, 53) connects such that the plurality of frame members (21 to 24, ...