Inset Fed Circular Microstrip Antenna with Defected Ground

In this paper, a novel design of defected ground circular patch antenna using glass epoxy materials has been presented. The substrate of the intended antenna was prepared of glass epoxy, whereas patch and ground plane are made out of copper. Enhancement in the geometry is done by increasing the electrical length and volume without growing the size of the patch antenna. The simulations were accomplished using Computer Simulation Technology software and the association of measured and simulated results of anticipated antenna has been studied. Experimental and simulated outcome are in outstanding conformity.