Silver solder suitable for brazing of lead-free free cutting copper alloy

The invention relates to a silver solder suitable for brazing of a lead-free free cutting copper alloy, which belongs to welding materials of metal materials. The silver solder is characterized in that the silver solder contains, by weight percentage, Ag (silver) 1.5% to 25.0%, P (phosphorus) 4.5% to 9.0%, Se (selenium) 0.01% to 0.2%, S (sulfur) 0.005% to 0.1%, Hf (hafnium) 0.01% to 0.1%, and Cu (copper) in balance. The silver solder is a cadmium-free low-silver solder with good property in wetting and spreading the lead-free free cutting copper alloy, moderate solid-liquid phase line temperature and low silver content, and the soldering seam has the advantages of excellent plasticity and strength, and good cutting performance.