A novel metallization process for soldering graphite to copper at low temperature

Abstract A defect-free Sn-based metallization layer was prepared successfully on the surface of graphite at 950 °C for 30 min using Sn0.3Ag0.7Cu- 9%Cr (wt. %) metal powders. The typical interfacial microstructure of the metallization interface was β-Sn/Cr 3 C 2 /graphite. The formation mechanism of Cr 3 C 2 reaction layer was investigated in detail. Reliable soldered joint of metallized graphite to copper was achieved using Sn3Ag0.5Cu solder paste at 250 °C for 60 s in air, and the average shear strength of soldered joint reached 25 MPa. The novel metallization method provides a neoteric way for joining graphite and copper.