A method of providing chip stack elements

A method comprising: Forming one or more intermediate compounds (550a) on the top of a substrate (510a), wherein the one or more intermediate compounds (550a) over the top of the substrate (510a) extending over a first distance; Attaching a set of one or more chips (530a, 530b) at the top of the substrate (510a), wherein the one or more chips (530a, 530b) extend over the top of a second distance; Applying a stencil to the substrate (510a), wherein the template has a pattern corresponding to the one or more intermediate compounds (550a) formed on the upper substrate (510a) are formed such that the template (the amount of the sealing compound 545a) is reduced, which is formed on each of the one or more intermediate compounds (550a); and Applying a sealing compound (545a) on the upper surface of the substrate (510a) while the mask over the substrate (510a) is such that the sealing compound (545a) extends over the top side by a third distance, the third distance is less than the first distance and greater than the second distance, and a lower portion of the one or more intermediate compounds (550a) is encapsulated and an upper portion (551a) of the one or more compounds (550a) is exposed.