Research On Thermal Management Technology of System- Level Electronic Integrated Package

With the rapid development of modern electronic products, electronic products present a development trend of increasing packaging density, miniaturization and diversification of the environment. System-in-package (SiP) with the advantages of large-scale, multi-chip, and 3D three-dimensional packaging has attracted more and more attention. Due to the high-density interconnection between the components of the system-in-package circuit, the power density of the package is greatly increased, which will inevitably lead to an increase in the heat generation rate, so the research on its heat dissipation characteristics is particularly important. Introduced the theories and concepts of thermal management and heat transfer, expounded the general method of chip thermal management, took the plastic package SiP module as the research object, introduced the device-level junction-case thermal resistance and board-level junction-board thermal resistance analysis methods, introduction The heat dissipation technology of thermal conductive glue. It provides a reference for SIP package heat dissipation technology.