Manufacture and Characterization of Ultrathin Flexible Chips

As the processing engines for the flexible electronics, ultrathin chips have received extensive attention in recent years. This paper studies the fabrication of the ultrathin silicon chips by thinning and grinding, in which temporary support, release process, pick-up method and transfer technology have been recreated to thin the chips of different substrates. The electrical and mechanical properties of the prepared ultra-thin chip were characterized, and its performance did not significantly decrease compared with that before thinning.