Interfacial thermal contact resistance between aluminum nitride and copper at cryogenic temperature

The purpose of this study was to investigate the interfacial thermal contact resistance (ITCR) between aluminum nitride and copper. The ITCR was measured based on one-dimension steady-state heat conduction over a temperature range of 90–210 K and over a contact pressure range of 0.3–1.0 MPa. Our results show that the ITCR between aluminum nitride and copper decreases with increasing contact pressure, and increasing interfacial temperature. An ITCR model, which the influence of the surface layer on the ITCR is considered, is presented for prediction the ITCR.