Embedded strong-current high-power PCB (Printed Circuit Board) and manufacturing method thereof

The invention discloses an embedded strong-current high-power PCB (Printed Circuit Board) and a manufacturing method thereof. The method comprises: (1) milling a hollow groove on a core board; (2) fixedly clamping and embedding a conductor structure member which is same as the hollow groove in shape and not larger than the core board into thickness in the hollow groove; (3) laminating a first copper foil layer on the upper surface of the core board by a first semicuring piece, and laminating a second copper foil layer on the lower surface of the core board by a second semicuring piece; (4) drilling the laminated product, performing image transfer and image making on the first and second copper foil layers, forming a circuit needed by design and a part meeting large power and circuit control on the copper foil layers, simultaneously, performing hole metallization on the formed through hole to obtain the thickness of copper needed on the hole wall, and then performing solder masking manufacture; and (5) performing blind-sink hollowing on corresponding parts, needing to be connected on the product, of the conductor structure member after solder masking, exposing the conductor structure member, drilling the conductor structure member to form wire holes connected with other external connecting pieces. Compared with the prior art, in the invention, the conductor structure member is embedded into the inner layer of the PCB, interconnection of a large-current output end and an instrument input end by utilizing holes or surfaces on the conductor structure member, simultaneously, component packaging is performed by other circuit part lines except the high-power conductor structure member embedded into the PCB so as to control the circuit, so that the original wire connection is replaced to achieve the circuit control part, and the problems in the integration process of the power and circuit control parts of strong-current high-power electronic products are solved.