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In-situ deformation monitoring of thin electrochemically deposited copper lines during thermo-mechanical pulsing
In-situ deformation monitoring of thin electrochemically deposited copper lines during thermo-mechanical pulsing
2019
Manuel Kleinbichler
Sebastian Moser
Gerald Zernatto
Michael Nelhiebel
Johannes Zechner
Ernst Kozeschnik
Keywords:
Copper
In situ
Composite material
Deformation monitoring
Materials science
thermo mechanical
Correction
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