Short localization in CPU FlipChip using thermal imaging and magnetic current imaging: Advanced fault isolation technique comparison

Magnetic Current Imaging (MCI) and static Thermal Emission (TE), two commonly used Electrical Fault Isolation (EFI) tools, are compared on their ability to localize a short defect in a mobile device central processing unit (CPU). The short was localized by MCI between two micro bumps below the 100μm thick silicon die while TE detected a thermal signal slightly offset due to laser scribing on the die surface.