Hot melt for microwave heating

We will describe a method of releasably bonding substrates, wherein the adhesive is based on non-reactive polymers which contain at least 50 wt .-% of an ethylene vinyl acetate copolymers, and 0.05 to 15 wt.% Of polyols having a boiling point above 120 ° C. The corresponding bonding can be heated by microwave radiation, said Erweitungsbereich the hot melt adhesive is exceeded and the bonding of two substrate surfaces can be separated from each other.