Apparatus for producing metal ultramicro powder

A device for producing metal submicron powder comprises a pulverization tower, which is communicated with a vacuum pump and a melt liquid cavity. The melt liquid cavity is provided with a piston. Between the melt liquid cavity and pulverization tower is a compound pulverization nozzle composed of a subsonic speed pulverization nozzle and a Laval pulverization nozzle. The melt liquid cavity is communicated with the pulverization tower through a liquid tube. The subsonic speed pulverization nozzle and Laval pulverization nozzle are provided with a subsonic speed pulverization nozzle air inlet and a Laval pulverization nozzle inlet respectively. Meanwhile, the lower part of the Laval pulverization nozzle is connected with the cathode of an electric field dispersing device. With the double-polarity pulverization of double compound pulverization nozzles, the utility model realizes the effects of double layer split and ultrasonic speed sound wave vibrating metal liquid so as to obtain grains with smaller sizes; adding the electric field in the process of metal powder falling lowers the probability of metal powder agglomeration.