Bonding member, the wiring board for mounting semiconductor device provided with the adhesive member and the semiconductor device using the same

PROBLEM TO BE SOLVED: To provide an adhesive member having good heat resistance and moisture resistance required, when a semiconductor chip having a large thermal expansion coefficient between the semiconductor chip and a wiring substrate is loaded, especially an adhesive member having excellent storability at room temperature, etc. SOLUTION: This adhesive member has adhesive layers on the both surfaces. Therein, the adhesive layer on one side (surface A) has a flow distance of 100-1,000 μm, when it is stored for 1-30 days in an atmosphere at 25 deg.C and a RH of 50%, and has an adhesive strength of 300-3,000 N/m, when adhered to a polyimide film and then cured. The adhesive layer on the opposite side (surface B) has a flow distance of 50-1,000 μm, when stored for 1-90 days in an atmosphere having a temperature of 25 deg.C and a RH of 50%, and has an adhesive strength of 300-3,000 N/m, when adhered to a polyimide film and then cured. A substrate for loading a semiconductor is prepared by adhering the surface A side of the adhesive member to the semiconductor 6-loading surface of a wiring board. The semiconductor device is made to be a semiconductor device prepared by adhering the semiconductor chip 6 to the wiring substrate through the adhesive member.