The method of producing a porous copper-sintered, and the porous copper-sintered

PROBLEM TO BE SOLVED: To provide a copper particulate dispersed solution with high dispersibility and superior conductivity even after baking at a comparatively low temperature below 250°C after arrangement and drying on a substrate, and capable of providing a conductive member with little impurity, and to provide a method of forming a conductive circuit with high conductivity by a heating calcination method of applying a metal particulate dispersed liquid on a substrate. SOLUTION: The method of manufacturing the porous copper sintered film is characterized in that a copper particulate dispersed solution L of dispersing copper particulates wherein a mean particle size of primary particles is 1-500 nm in a solvent S configured such that it becomes a concentration of 2-70 mass% is applied on the substrate, the copper particulates are sintered by inserting the substrate applied with the copper particulate dispersed solution L into a furnace heated to 160-500°C and quickly heating it in an inert gas atmosphere, and the sintered film with porosity of 40-70% is formed on the substrate. A porous copper sintered film being one example of the porous copper sintered film is indicated in the figure. COPYRIGHT: (C)2010,JPO&INPIT