New poly-maleimide resin for SOC hardmask with high thermal stability

We develop maleimide derivatives named “NeoFARIT N0XX (NFN0XX)” series which show excellent thermal stability as SOC materials. [1] For example, NFN006 shows a slight weight loss In this paper, we report further improved thermal performance of maleimide resin called NeoFARIT N011 (in short NFN011) with lower shrinkage during curing process. The shrinkage of NFN011 in 250oC bake is less On the other hand, NFN011, which exhibits excellent thermal stability, has a problem of low solubility in PGMEA and PGME, which are commonly used solvent in lithography processes. On this solubility issue, we newly develop NeoFARIT N012 (in short NFN012), which includes a methyl group on the maleimide moiety of NFN011. NFN012 shows both good solubility in PGMEA and sufficient thermal stability. It shows slight weight loss <5% at 450oC in the air atmosphere on TG-DTA analysis. In addition, its shrinkage in 250oC bake is less <5% in the air. We have succeeded in developing a new material that exhibited good solubility in PGMEA and PGME, sufficient thermal stability, and low sublimability.