Old Web
English
Sign In
Acemap
>
Paper
>
Electrical-thermal analysis of packaged power terminals for thermal processing of semiconductor wafers
Electrical-thermal analysis of packaged power terminals for thermal processing of semiconductor wafers
2017
Dea-Seong Woo
Kyoung Joon Kim
Keywords:
Thermal
Finite element method
Thermal analysis
Semiconductor
Wafer
Electronic engineering
Materials science
Optoelectronics
Correction
Source
Cite
Save
Machine Reading By IdeaReader
0
References
0
Citations
NaN
KQI
[]