An ultra low power 3D integrated intra-chip silicon electronic-photonic link

A record low energy (250fJ/bit) intra-chip electronic-photonic link is demonstrated at 5Gb/s on a 3D-integrated wafer using through-oxide-vias (1.45fF-per-via) for the first time. The receiver sensitivity was −19.3dBm and the on-chip laser energy was 6fJ/bit.