A Distributed Compact Model for High-Density, On-Chip Trench Capacitors in High-Frequency Applications

Trench capacitors integrated in a cost-effective manner into silicon for high-density decoupling capacitance applications have been fabricated and characterized. The capacitors are robust and highly linear over voltage and insensitive to temperature. A distributed model for the device is presented here. The model is computationally efficient and capable of predicting the frequencydependence of Y-parameters.