On the Temperature Profile of the Thermally Excited Resonant Silicon Micro Structural Pressure Sensor

According to the sensing structure of a practical silicon resonant pressure micro sensor whose preliminary sensing unit is a square silicon diaphragm and the final sensing unit is a silicon beam resonator, its operating mechanism is analyzed. The thermal resistor acts as the excited unit, and the piezoresistive unit acts as the detector, for the above micro sensor. By using the amplitude and phase conditions, the self exciting closed loop system is investigated based on the operating mechanism for the above micro sensor. The temperature profile model and the thermal stress model are established for the beam resonator of the micro sensor. Moreover, the thermal feature is simulated and analyzed for the above micro sensor.