Seal for Vias

The invention relates to an arrangement with a first circuit board (101), a second circuit board (103), at least one press-fit pin (105) and at least one sealing element (107); wherein the first circuit board (101) has a first via (109) and the second circuit board (103) a second via (111); wherein the press-fit pin (105) is pressed into the first via (109) and / or soldered to the first via (109) and to be in the second via (111) is pressed and / or with which the second via (109) to be soldered, so that the press-fit pin (105) connecting the first via (109) and the second via (111) electrically conductive with each other; and wherein the seal (107) is configured to seal the first via (109) and the second via (111) relative to a between the first circuit board (101) and the second circuit board (103) extending gap (113). The sealing element (107) is clamped between the first circuit board (101) and the second circuit board (103).