Epoxy resin composition as well as prepregs and laminated plate using same

The invention belongs to the technical field of copper-clad plates and relates to an epoxy resin composition as well as prepregs and a laminated plate using the same. The thermosetting resin composition comprises epoxy resin, a flexible primary amine curing agent, phenolic resin and a curing accelerator. The copper-clad plate prepared from the epoxy resin composition comprises a plurality of laminated prepregs, and copper foils arranged at one side or both sides of the laminated prepregs, wherein each prepreg comprises a reinforcing material and the epoxy resin composition which is impregnated, dried and attached to the reinforcing material. Flexible primary amine adopted in the epoxy resin composition is used as both a curing agent and a toughening agent of a phenolic-cured epoxy resin system, the prepared copper-clad plate has the advantages that better toughness is achieved and Tg is not decreased, and the problem that the Tg of the copper-clad plate is decreased caused by the use of multiple common toughening agents is solved.