High-strength lightweight composite board and preparation method thereof

2011 
The invention relates to a high-strength lightweight composite board and a preparation method thereof, and belongs to the field of composite boards. The preparation method comprises the following steps of: depositing a titanium nitride thin film on an aluminum foil, depositing a titanium-silicon-nitrogen thin film on the titanium nitride thin film, and depositing a titanium nitride thin film on the titanium-silicon-nitrogen thin film, thus obtaining a basic composite board. The high-strength lightweight composite board has the advantages that: the lightweight soft metal aluminum foil is used as a soft layer, the high-hardness titanium-silicon-nitrogen thin film is used as a hard layer, and the titanium nitride thin film is arranged between the aluminum foil and the titanium-silicon-nitrogen thin film, in order to increase the interlayer binding property and avoid delamination caused by sudden hardness change; in specific process, the composite board is prepared by a surface deposition method at certain temperature, rate and specific deposition frequency; and in order to adapt to different working conditions, multiple basic composite boards are adhered to form a multilayer aluminum/titanium nitride/titanium-silicon-nitrogen composite board, thus an expected lightweight, low-consumption and high-performance composite board is obtained, namely a high-strength lightweight composite board with strong impact resistance, large specific modulus and high capability of absorbing higher-frequency load is provided.
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