Solute distribution behind a cellular solid-liquid interface

Abstract Observations have been made of the solute distribution behind an advancing solid/liquid cellular interface in directionally grown Al-Cu alloys, quenched during solidification. The solute distribution pattern was seen to change markedly with increasing distance behind the interface. These changes were compared with those in the same material resulting from solution treatments over a range of temperatures. This comparison indicated that the changes in the as-grown specimens could be accounted for by diffusion. In addition, the results suggest that a high density of dislocation is generated in the material for relieving thermal stresses when these develop during cooling to ambient temperature.