3D integration of organic transistors and circuits

Abstract Direct printing of thin-film transistors has enormous potential for ubiquitous and lightweight wearable electronic applications. However, advances in printed integrated circuits remain very rare. Here we introduce a three-dimensional (3D) integration approach to achieve technology scaling in printed transistor density, analogous to Moore’s law driven by lithography. Recent progress on design and fabrication of 3D-integrated organic printed transistors and circuits is reviewed in the first part of the chapter. We then discuss 3D-printed integrated circuits (ICs) development process with a focus on modeling and simulation of the 3D devices and circuits, which is essential to transfer printed electronics technology from lab to fab manufacturing. This chapter provides insights into the realization of functional organic 3D ICs and unconventional electronics applications.