Reduction of Chipping out in Die Separation Process of Psi Technologies Inc. Using DMAIC Methodology

DMAIC methodology is known to be the roadmap of problem solving as well as reducing defects and processimprovement. The main objective of the study is to reduce the defects in the production of the company using DMAICmethodology. The study was conducted in Psi Technologies Inc. located at lot C3-6 Carmelray, Industrial Park II,Barangay Punta, Calamba City, Laguna Philippines. In this work, the data were obtained from the company anddifferent defects within the production were analyzed. The die chipping out was found to be the highest number ofdefects caused in the production line. In addition, process mapping has been carried out to see which process is thehighest contributor to chipping out and, as a result, the process of die separation contributes to the highest numberof chipping out. The authors analyzed the die separation process and found that the machine rollers used to separatethe die were not working well and were the root cause of the defect. Thus, the findings have shown that it isnecessary to regularly change the rollers of the die separation machine in order to reduce the defective chipping.