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Enhancement of Board Level Reliability on Automotive DRAM Package by Optimized Thermal & Mechanical Properties
Enhancement of Board Level Reliability on Automotive DRAM Package by Optimized Thermal & Mechanical Properties
2020
Jong-gi Lee
Jin-Soo Bae
Yeo Hoon Yoon
Jun-Ho Lee
Kang-young Cho
Keywords:
Materials science
Automotive engineering
Automotive industry
thermal mechanical
Dram
Correction
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