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Thermal Resistance and Transient Thermal Analysis of SiC Power Module Using Ni Micro Plating Bonding
Thermal Resistance and Transient Thermal Analysis of SiC Power Module Using Ni Micro Plating Bonding
2019
Akihiro Imakiire
Masahiro Kozako
Masayuki Hikita
Kohei Tatsumi
Masakazu Inagaki
Tomonori Iizuka
Nobuaki Sato
Koji Shimizu
Kazutoshi Ueda
Kazuhiko Sugiura
Kazuhiro Tsuruta
Keiji Toda
Keywords:
Engineering
Power module
Control theory
Thermal analysis
Thermal resistance
Composite material
Lead frame
Correction
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