Robustness and Versatility of Thin Films on Low Temperature Cofired Ceramic (LTCC)

Thin film multilayers have previously been introduced on multilayer low temperature cofired ceramic (LTCC). The ruggedness of a multipurpose Ti-Cu-Pt-Au stack has continued to benefit fabrication and reliability in state-of-the-art modules. Space optimization is described, preserving miniaturization of critical spaces and component pads. Additional soldering details are also presented, including trends with solder-stop materials. Feature compensation becomes a simple step in the normal manufacturing flow which enables exact targeting of desired feature sizes. In addition, fine details of the manufacturing process, including ion milling, will be discussed. We will discuss full long-term aging results and structural details that reinforce the reliability and function. Different thin film materials for specific applications can be exploited for additional capabilities such as filters and other integral components. Cross sections verify the results shown. This successful integration of thin films on LTCC poin...