Method for fabricating array subtrate and fabrication apparatus used therefor

PURPOSE: A manufacturing method of an array substrate and a manufacturing apparatus used in the same remove of lessen the stress occurred by the thermal expansion coefficient between a substrate and a conductive film, preventing the bending of a substrate. CONSTITUTION: A semiconductor layer (130) is formed on a base substrate (110). The semiconductor layer comprises a source area (131), a drain area (132), and a channel area (133) between the drain area and the source area. A gate electrode (150) is insulated from the semiconductor layer by a first insulating layer (140). A source electrode (171) and a drain electrode (175) connected to the semiconductor layer are formed. A pixel electrode (190) connected to the drain electrode is formed.