Old Web
English
Sign In
Acemap
>
Paper
>
TWO STACKED THIN CHIPS FOR 3D SYSTEM IN PACKAGE
TWO STACKED THIN CHIPS FOR 3D SYSTEM IN PACKAGE
2005
Akihiro Ikeda
Yosuke Sugimoto
Tomonori Kuwada
Satoru Kajiwara
Tsuyoshi Fujimura
Kazuya Iwasaki
Hiroshi Ogi
Kiyoshi Hamapchi
Hisao Kuriyaki
Reiji Hattori
Yukinori Kuroki
Higashi-ku Fukuoka
Minamata Kumamoto
Keywords:
Chip-scale package
System in package
Electronic engineering
Materials science
Computer hardware
Correction
Source
Cite
Save
Machine Reading By IdeaReader
2
References
0
Citations
NaN
KQI
[]