Bulk and shear moduli of epoxy encapsulants

The bulk moduli of common epoxy-based electronic encapsulating polymers were measured directly at room temperature. The dynamic shear moduli of these polymers were measured as a function of temperature and, for some, as a function of frequency. The temperature-frequency data have been combined to calculate WLF shift parameters, and room temperature moduli have been compared to historical values. Analytical procedures have been documented in detail so users may fully understand the accuracy and limitations of the results. 9 refs., 6 figs., 5 tabs.