Telecom Research Laboratories Martlesham Heath. Ipswich, Suffolk UK Abstract A novel CAD system for

A novel CAD system for use in the manufacture of high resolution chrome masks for wafer scale integrated optic devices is described. The etching of titanium waveguide structures is considered and it is demonstrated that SF. plasma etching techniques can be used to advantage. The packaging requirements of wafer scale integrated optic structures are out­ lined and a novel fibre attachment technique described. In this paper three key technologies for the fabrication of wafer scale integrated optic devices will be discussed. Initially a novel CAD system for integrated optics will be outlined and its use in the fabrication of masks by e-beam techniques described. The problems of etching high aspect ratio titanium waveguide structures will then be discussed and the advantages of using dry plasma etching processes demonstrated. Finally the problems of ruggedly packaging the device will be outlined and a novel fibre attachment technique described. Computer aided design and manufacture of chrome masks The production of chrome masks for wafer-scale integrated optic devices presents a number of problems which are not normally encountered with integrated circuit manufacture.