Conditions for compressive residual stress occurrence at interface edge of bonded dissimilar materials

Summary In elastic bonded dissimilar materials subjected to cooling or heating, the thermal stresses at the intersection of the edges and interface edge are singular. The thermal stresses are represented by the sum of the singular solutions, the singularity disappearance solution and the particular solution. This paper describes a theoretical investigation of the relationship between two stress intensities (K1 and K2) for the singular solutions and edge angles of metal/ceramic composites. The bonded edge angle at which the stress intensity becomes zero is indicated. The distribution shapes of K1 and K2 at the interface edge correspond to modes I and II, respectively. The sign of the distribution varies depending on the edge angle combination. The bonded edge angle giving K1 (or K2) = 0 and the conditions for stress singularity disappearance based on both the stress exponents and intensities are shown on the ϕ1 + ϕ2 (total angle of bonded edge) - ϕ1 (edge angle of material 1) plane. According to the circum...