The voids growth path on Sn-Ag thin film under high current density

In this study, electromigration (EM) behavior in a Sn-Ag solder thin-film stripe deposited on a glass substrate has been investigated under a current density of 4.4 × 104A/cm2. A new method run in Matlab, “Random walk” was first put forward to on the simulation of void formation. The findings show that the current density and thermal distribution play important roles for the void formations on the cathode if the thermal gradient in the specimen is completely neglected.