And a method of manufacturing apparatus for photosensitive laminate

Producing means (20) having: a first and second feeding means (32a, 32b); first and second processing means (36a, 36b); first and second label bonding mechanisms (40a, 40b); a first and second storage means (42a, 42b); first and second peeling mechanisms (44a, 44b); a substrate feeding mechanism (45); attaching means (46); and a base peeling mechanism (186). Cooling means (122) are provided attachment means (46) and a base peeling mechanism (186) between, for cooling the attached substrate (24a), attached to the substrate (24a) of a glass substrate (24) and attached thereto, the protective film had been peeled off (30) of the photosensitive plate (22) is made. Heating means (182) for attaching the substrate to the cooled resin layer (24a) of example, a buffer layer (27) is heated to a glass transition temperature or glass transition temperature of a predetermined temperature range.