Processing liquid, substrate cleaning method, and resist removal method

The present invention addresses the issue of providing a processing liquid that has excellent residue removal performance and excellent corrosion resistance against metal layers containing Co and is capable of suppressing the occurrence of defects. The present invention also addresses the issue of providing a substrate cleaning method and a resist removal method. The processing liquid is for semiconductor devices and contains a fluorine-containing compound, an anticorrosion agent, and calcium. The calcium mass ratio content relative to the fluorine-containing compound content in the processing liquid is 1.0 × 10 -10 - 1.0 × 10 -4 .