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Technical Challenges for 3D Packaging and Chip Package Interaction
Technical Challenges for 3D Packaging and Chip Package Interaction
2011
Orii Yasumitsu
Toriyama Kazushige
Horibe Akihiro
Matsumoto Keiji
Sakumai Katsuyuki
Keywords:
Computer engineering
Chip
Engineering
Embedded system
Computer science
Correction
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